Sec. 221.048. BOND PROCEEDS. If the use authorized by the order or resolution authorizing the issuance of a bond under Section 221.046, the bond proceeds may be used to:
(1) pay interest on the bond during or after the acquisition or construction of an improvement project financed by the bond issue;
(2) pay administrative and operation expenses;
(3) create a reserve fund for payment of the principal of and interest on the bonds; or
(4) create any other fund.
Added by Acts 1997, 75th Leg., ch. 165, Sec. 24.01(a), eff. Sept. 1, 1997.
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