Sec. 1. The board may issue bonds to pay the following:
(1) The cost of the works that are provided in the district plan.
(2) Necessary engineering, legal, and administrative fees.
(3) The repayment or refinancing of a loan.
[Pre-1995 Recodification Citation: 13-3-3-81 part.]
As added by P.L.1-1995, SEC.26.
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